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[Market Report] Global Market for System-in-Package Technology

[Market Report] Global Market for System-in-Package Technology

The global market for system-in-package technology is expected to surge to 34 billion USD by 2031, reflecting a CAGR of 9.7%.

The global System in Package (SiP) technology market is experiencing significant growth, projected to reach 34 billion USD by 2031. This growth trajectory reflects a robust compound annual growth rate (CAGR) of 9.7% during the forecast period from 2023 to 2031. In 2022, the market recorded sales of approximately 14.8 billion USD. System in Package (SiP) technology is revolutionizing the semiconductor industry by providing compact integrated solutions that consolidate multiple functions within a single package. The global SiP market is characterized by technological innovation, collaboration, and continuous advancement in semiconductor packaging. Major companies are investing in research and development to introduce cutting-edge SiP solutions that meet the evolving demands of industries worldwide. For application methods, please check the [PDF download] button or apply directly through the related links.

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MTI RFID reader chip equipped SiP MS series

MTI RFID reader chip equipped SiP MS series

A high-performance system-in-package that integrates RAIN RFID reader chip IC (Impinj E series) and RF front-end circuit.

MTI's RFID reader chip SiP is a System in Package (SiP) that integrates the RFID reader chip IC (E series) from Impinj, a company with a global share in the RFID market, with an RF front-end circuit optimized by Microelectronics Technology Inc (MTI). The SiP combines multiple functional chips into a single package measuring 11mm x 11mm, making it a complete functional unit that provides an optimal solution for various types of devices with limited dimensions. The compact and high-performance MTI RFID reader chip SiP is ideal for equipment such as mobile readers, printers, small fixed readers, embedded enterprise devices (shelf readers, security access, etc.), hands-free enterprise devices (wearables, thread-style readers), and IoT devices with RAIN RFID capabilities like mobile POS and smart appliances. This leads to a shortened product development cycle and rapid market introduction of products. (Development kits and sample SiPs are also available.)

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